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Short Courses



Short Course 1

Short Course 2

Short Course 3

Short Course 4

Short Course 5






A variety of Short Courses will be offered on Sunday, June 21st from 8:00 a.m. - 12:00 p.m. covering the latest advancement and development in the field of solid-state sensors, actuators and microsystems.

Each half-day short course will consist of 4 hours of lectures. Fee includes entrance to one short course, one copy of the course notebook, and coffee breaks. The attendees must choose the course(s) or lectures they would like to attend at the time of registration as there will be no in and out privileges and material will only be prepared for those who sign up for the Sunday Short Course. Early registration is encouraged as seating is limited and registration is on a first-come, first-served basis. On-site registration will be very limited.

All Short Courses will be held at the Hilton Anchorage Hotel

Hilton Anchorage Hotel
500 West 3rd Avenue
Anchorage, AK 99501

Visit this link to add a short course to an existing registration.


Short Course 1: Patents - Clearing the Haze
Instructor: James Walker - Kaplan Breyer Schwartz & Ottesen, LLP, USA

This goal of this course is to provide inventors, business leaders, and those who might be considering starting a company with a better understanding of just what the patent process is, why it matters, how to recognize a well-prepared patent, and how to ease the pain involved in obtaining one while improving the return on the investment. Many misconceptions exist regarding what is patentable, what benefits patents afford, why they are important in business, and how to best utilize them. In this course, we will clear up many of those misconceptions. In addition, bad experiences have turned many engineers/scientists off from the patent process in general. As a result, they avoid filing for patents or engage with their attorneys at a minimal level. We will outline simple approaches that can dramatically improve the preparation process, while also improving the quality of the resultant application. We will also educate the audience on the recent changes to patent law (the America Invents Act) and what ramifications these changes might have on them.

In addition, we will address considerations important for start-up companies, including: how to effectively protect important technologies; the impact the existent patent landscape can have on the freedom to use one's own technology; and issues surrounding patent licensing.

Who Should Attend:

This course is intended for inventors and decision makers involved in the patent process - specifically, for those individuals who need to interact with counsel to prepare and file applications, those involved in M&A activities, and those who are involved in deriving a return on the investment made in obtaining patent properties.

Maximum Attendance: 120

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Short Course 2: MEMS System Integration
Instructors:
Valerie Marty - Hewlett Packard, USA
Alissa Fitzgerald, Ph.D. - AM Fitzgerald & Associate, USA

The presenters will provide an innovation framework overview identifying key system integration aspects in the commercialization process. Examples of systems/products that integrate MEMS devices will be reviewed. Attendees will work in teams to construct a technology functional matrix of the MEMS device and assess system issues specific to market and supply chain considerations. The course will be interactive and encourage discussion.

Who Should Attend:

Graduate students, researchers and technology innovators who want insights regarding systems interactions and recruiters looking for talented students who can illustrate systems thinking.

Maximum Attendance: 40

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Short Course 3: Wafer Bonding Processes & Technology
Instructor: Eric Pabo, Ph.D. - EV Group, USA

1. Wafer bonding (Part 1)
	a. Overview, including value proposition for wafer level bonding
	b. Bonding processes overview
	c. Bonding process variables
		i. Input
		ii. Process
		iii. Output
	d. Bonding process versus bonding process variables
	e. Oxide management for metal based bonding processes
2. Alignment for Bonding
	a. Alignment processes for wafer bonding
	b. Alignment error budget
3. Wafer bonding (Part 2)
	a. Process for selecting a bonding process
	b. Product examples for wafer bonding
	c. Metrology and process control for wafer bonding
	d. Current trends in wafer bonding
4. Comparison of wafer to wafer bonding to chip to wafer bonding
5. Summary
Who Should Attend:

This course will be beneficial for those designing products utilizing wafer bonding, those having wafer level bonding outsourced to a foundry, those developing or maintaining wafer bonding processes, and those who want to learn more about wafer bonding. Prior experience in wafer bonding is not necessary but a basic understanding of physics, chemistry and material science will be helpful. The information learned in this course will be applicable to wafer to wafer, chip to wafer, and chip to chip bonding.

Maximum Attendance: 120

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Short Course 4: A Crash Course in Labs-on-a-Chip
Instructors:
Johan Nilsson, Ph.D. - Lund University, SWEDEN
Sabeth Verpoorte, Ph.D. - University of Groningen, THE NETHERLANDS

Lab-on-a-chip. We've all heard about it, but what's it really about? What does a chip look like? How does it work? How can you make one? And most important, what's it good for?? With one foot in engineering and physics, the other in chemistry and the life sciences, lab-on-a-chip technology has enabled research having an astounding interdisciplinary breadth. This course will introduce you to the basics of the technology, to get you started on your exploration of this fascinating field and talking about it with your colleagues.

Who Should Attend:

We welcome both junior and senior research scientists from industry or academia, interested in getting a basic understanding of the design, fabrication and operation of lab-chip devices, and their applications.

Maximum Attendance: 40

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Short Course 5: Polymer Microfabrication Methods and Technologies
Instructor: Holger Becker, Ph.D. - microfluidic Chipshop, GERMANY

This course provides attendees with an introductory overview on the fabrication methods and applications of polymer based microsystems, including an examination of fabrications methods such as photolithography, LIGA, 3D-printing, laser ablation, casting, hot embossing and injection molding. The course covers an overview on polymer materials, the methods used in optical patterning, and replication methods for high-volume fabrication. Based on a variety of practical examples in microoptics, BioMEMS and medical devices, you will be able to understand the basic principles of the fabrication methods as well as identify possible solutions for your specific application area. The course will provide a practical approach to microfabrication techniques and the necessary equipment.

Who Should Attend:

This course is intended for a technical or managerial audience with an interest in microfabrication techniques and applications. For those with an education and knowledge in classical silicon MEMS it will prove a valuable extension of their know-how.

Maximum Attendance: 120

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