General Info Executive Committee Program Committees Previous Conferences

Executive Technical Program Committee Tayfun Akin Middle East Technical University TURKEY   Chee-Yee Kwok University of New South Wales AUSTRALIA David Arnold University of Florida USA   Franz Laermer Robert Bosch GmbH GERMANY Rashid Bashir University of Illinois, Urbana-Champaign USA   Zhihong Li Peking University CHINA Jürgen Brugger EPFL SWITZERLAND   Ellis Meng University of Southern California USA Corrado Di Natale University of Rome Tor Vergata ITALY   Jianmin Miao Nanyang Technological University SINGAPORE David Elata Technion - Israel Institute of Technology ISRAEL   Dave Monk Freescale Semiconductor USA Weileun Fang National Tsing Hua University TAIWAN   Liviu Nicu CNRS FRANCE Gary Fedder Carnegie Mellon University USA   Pasqualina M. Sarro Delft University of Technology THE NETHERLANDS Sami Franssila Aalto University FINLAND   Shuichi Shoji Waseda University JAPAN Luc Fréchette Université de Sherbrooke CANADA   Shoji Takeuchi University of Tokyo JAPAN Reza Ghodssi University of Maryland USA   Evelyn Wang Massachusetts Institute of Technology USA Amy Herr University of California, Berkeley USA   Eric Yeatman Imperial College London UK Jerwei Hsieh Asia Pacific Microsystems TAIWAN   Jun-Bo Yoon Korea Advanced Institute of Science and Technology SOUTH KOREA Satoshi Konishi Ritsumeikan University JAPAN   Technical Program Committee Chang-Wook Baek Chung-Ang University, SOUTH KOREA Giuseppe Barillaro University of Pisa, ITALY Nicolae Barsan University of Tübingen, GERMANY István Bársony Hungarian Academy of Sciences, HUNGARY Rajashree Baskaran Intel, USA Sarah Bedair Army Research Lab (ARL), USA Sunil Bhave Cornell University, USA Jong-Uk Bu SenPlus, SOUTH KOREA Lionel Buchaillot IEMN, CNRS, FRANCE Cullen Buie Massachusetts Institue of Technology, USA Yu-Ting Cheng National Chiao Tung University, TAIWAN Mu Chiao University of British Columbia, CANADA Marina Cole University of Warwick, UK Jesús M. Corres University of Navarra, SPAIN Petra Dittrich ETH Zurich, SWITZERLAND Jens Ducrée Dublin City University, IRELAND Isabelle Dufour IMS,CNRS, FRANCE Amy Duwel Draper Labs, USA Phillip Feng Case Western Reserve University, USA Maximilian Fleischer Siemens AG, GERMANY Hans Gardeniers University of Twente, THE NETHERLANDS Einar Halvorsen HiVe, NORWAY Andreas Hierlemann ETH Zurich, SWITZERLAND Qing-An Huang Southeast University , CHINA Adrian Ionescu EPFL, SWITZERLAND Bernhard Jakoby JKL University, AUSTRIA Ki-Hun Jeong KAIST, SOUTH KOREA Hanseup Kim University of Utah, USA Jongbaeg Kim Yonsei University, SOUTH KOREA Sunghoon Kwon Seoul National University, SOUTH KOREA Jeroen Lammertyn KU Leuven, BELGIUM Chengkuo Lee National University of Singapore, SINGAPORE Yi-Kuen Lee Hong Kong University of Science and Technology, HONG KONG Sheng-Shian Li National Tsing-Hua University, TAIWAN Xinxin Li Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, CHINA Che-Hsin Lin National Sun Yat-sen University, TAIWAN Yu-Cheng Lin National Cheng Kung Univ., TAIWAN Carol Livermore Northeastern, USA Mary Ann Maher softMEMS, USA Matthew McCarthy Drexel University, USA Norihisa Miki Keio University, JAPAN Paul Mitcheson Imperial College, UK Takahiro Nishimoto Shimadzu Corporation, JAPAN Gary O'Brien Bosch, USA Connor O'Mahony Tyndall Institute, IRELAND Joachim Oberhammer KTH, SWEDEN Takahito Ono Tohoku University, JAPAN Sumita Pennathur University of California at Santa Barbara, USA Gianluca Piazza Carnegie Mellon University, USA Beth Pruitt Stanford University, USA Mina Rais-Zadeh University of Michigan, USA Luis Rocha University do Minho, PORTUGAL Xavier Rottenberg IMEC, BELGIUM Kazuaki Sawada Toyohashi University of Technology, JAPAN Tiina Sikanen University of Helsinki, FINLAND Elisabeth Smela University of Maryland, USA Chip Spangler Aspen Technologies, USA Yu Sun University of Toronto, CANADA Yuji Suzuki University of Tokyo, JAPAN Srinivas Tadigadapa Penn State University, USA Shuji Tanaka Tohoku University, JAPAN Svetlana Tatic-Lucic Lehigh University, USA Hiroshi Toshiyoshi University of Tokyo, JAPAN Alex Trusov Northrop Grumman, USA Fan-Gang Tseng National Tsing-Hua University, TAIWAN Toshiyuki Tsuchiya Kyoto University, JAPAN Joost van Beek NXP Semiconductors, THE NETHERLANDS Michael Vellekoop University of Bremen, GERMANY Xiao-Hong Wang Tsinghua University, CHINA Peter Woias IMTEK, GERMANY Man Wong Hong Kong University of Science & Technology, HONG KONG Wengang Wu Peking University, CHINA Yong-Kyu Yoon University of Florida, USA Xin Zhang Boston University, USA Maryam Ziaei-Moayyed iSono Health, USA

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