General Info Executive Committee Program Committees Previous Conferences

General Chair Thomas W. Kenny Stanford University USA   Technical Program Chair Victor M. Bright University of Colorado, Boulder USA   Regional Program Chairs Americas Gary Fedder Carnegie Mellon University USA   Europe/Africa Pasqualina M. Sarro Delft University of Technology THE NETHERLANDS Asia/Oceania Shuichi Shoji Waseda University JAPAN   Tuesday MIG Session Chair Karen Lightman MEMS Industry Group   Short Course Chair Amy Herr University of California, Berkeley USA   Student Travel Support Chair Robert Candler University of California, Los Angeles USA   Commercial Support Committee Joe Brown Joe Brown MEMS USA   Christofer Hierold ETH Zurich SWITZERLAND Masayoshi Esashi Tohoku University JAPAN   Dave Monk Freescale Semiconductor USA Weileun Fang National Tsing Hua University TAIWAN   Gary O'Brien BOSCH USA Local Arrangements Committee Karl Böhringer University of Washington USA   Chip Spangler Aspen Microsystems USA Boris Stoeber University of British Columbia CANADA   Treasurer Dave Monk Freescale Semiconductor USA   Conference Manager Katharine Cline Preferred Meeting Management, Inc. USA International Steering Committee Chair Kenny, Thomas Stanford University, US Vice-Chair Morante, J.R. Universitat de Barcelona and IREC, ES Members Akin, Tayfun Middle East Technical University, METU-MEMS Center, TR Allen, Mark University of Pennsylvania, US Bausells, Joan Barcelona Microelectronics Institute, IMB-CNM (CSIC), ES Bohringer, Karl University of Washington, US Brugger, Jürgen EPFL, CH Cho, Dong-il (Dan) Seoul National University, KR Fang, Weilun National Tsing Hua University, TW Fedder, Gary Carnegie Mellon University, US Gianchandani, Yogesh University of Michigan, US Hsieh, Jerwei Asia Pacific Microsystems, Inc., TW Kattelus, Hannu VTT, FI Konishi, Satoshi Ritsumeikan University, JP Li, Xinxin Shanghai Institute of Microsystem and Information Technology, CN Liu, Ai-Qun Nanyang Technological University, SG Mehregany, Mehran Case Western Reserve University, US Monk, Dave Freescale Semiconductor, Inc., US Nguyen, Clark University of California at Berkeley, US Renard Stéphane Tronic's Microsystems, FR Sarro, Lina Delft University of Technology, NL Sawada, Kazuaki Toyohashi University of Technology, JP Shoji, Shuichi Waseda University, JP Yeatman, Eric Imperial College London, UK Zengerle, Roland HSG-IMIT & IMTEK - University of Freiburg, DE Ex-Officials Chang, S. C. General Motors Research Laboratory, US Chun, Kukjin Seoul National University, KR Delapierre, Gilles CEA-LETI, FR Esashi, Masayoshi Tohoku University, JP Fujita, Hiroyuki University of Tokyo, JP Han, Sang-Do Korean Institute of Energy Research, KR Hierold, Christofer ETH Zurich, CH Hocker, G. Benjamin Honeywell International Inc, US Howe, Roger T. Stanford University, US Ishida, Makoto Toyohashi University of Technology, JP Kataoka, Shoei Sharp Corporation, JP Ko, Wen H. Case Western Reserve University, US Lundström, Ingemar Linköping University, SE Middelhoek, Simon Deft University of Technology, NL Moriizumi, Toyosaka Tokyo Institute of Technology, JP Muller, Richard University of California Berkeley, US Najafi, Khalil University of Michigan, US Pfister, G. Cerberus AG, CH Puers, Robert Katholieke Universiteit Leuven, BE de Rooij, Nico University of Neuchatel, CH Sasaki, Akio Kyoto University, JP Schmidt, Martin Massachusetts Institute of Technology, US Schweitz, Jan-Ake Uppsala University, SE Seidel, Helmut University of Saarland, Saarbrucken, DE Senturia, Stephen D. Massachusetts Institute of Technology, US Sohn, Byung-Ki Kyungpook National University, KR Stemme, Göran Royal Institute of Technology, Stockholm, SE Syms, Richard Imperial College of London, UK Takahashi, Kiyoshi Kumamoto University School of Medicine, JP Wise, Kensal D. University of Michigan, US Xia, Shanhong Institute of Electronics, Chinese Academy of Sciences, CN

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